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JP2003516629A |
A method of manufacturing an electronic device comprising an integrated circuit device having micromechanical switches (10) and thin film circuit components (20) provided on a common substrate (2). The micromechanical switches (10) have ...
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JP2003133880A |
To provide an MEMS component.This microelectro-mechanical component 1 formed at the substrate of a semiconductor base, and provided with two input terminals and two output terminals is constituted of a movable element 4 connected to the ...
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JP3402642B2 |
PURPOSE: To provide an electrostatic driven relay capable of obtaining sufficient contact pressure, having nice contact reliability, including high inter-contact pressure resistance and requiring only low application potential to an elec...
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JP3402626B2 |
PURPOSE: To provide an electrostatic driving relay wherein applied voltage to an electrode is required low to obtain good contact reliability also high intercontact dielectric strength by sufficiently obtaining a contact pressure. CONSTI...
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JP2003515235A |
A microelectromechanical (MEM) switch is fabricated inexpensively by using processing steps which are standard for fabricating multiple metal layer integrated circuits, such as CMOS. The exact steps may be adjusted to be compatible with ...
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JP2003513411A |
An optically controlled micro-electromechanical (MEM) switch is described which desirably utilizes photoconductive properties of a semiconductive substrate upon which MEM switches are fabricated. In one embodiment the bias voltage provid...
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JP3393678B2 |
PURPOSE: To eliminate breakage of a support end part by vibration or impact, and make metal function also as a mask material by sticking the metal on a movable piece composed of a silicon wafer, and constituting at least the periphery of...
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JP3393467B2 |
To provide a designed operating characteristic hard to generate the thermal stress and thermal deflection by collecting plural anchors for standing at a part in a top surface of a base, and supporting a movable electrode through a thin p...
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JP2003506822A |
The invention relates to a relay, especially a miniaturized electrostatic relay, comprising a bridge-type make contact. The contact spring is designed as a torsion spring that is linked with a switching spring (3) via multiply bent sprin...
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JP3374804B2 |
A phase shifter for switching passing phase of a high-frequency signal by means of ON/OFF control of a micro-machine switch, the micro-machine switch comprising cantilevers (11a), (11b) with one ends thereof connected to a second distrib...
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JP2003504857A |
Electrical devices comprised of nanoscopic wires are described, along with methods of their manufacture and use. The nanoscopic wires can be nanotubes, preferably single-walled carbon nanotubes. They can be arranged in crossbar arrays us...
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JP2003504906A |
Power amplifiers having reactive networks (such as classes C, C-E, E and F) employ tunable reactive devices in their reactive networks, with the reactive devices respective reactance values capable of being adjusted by means of respectiv...
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JP2003503816A |
A MEMS (Micro Electro Mechanical System) electrostatically operated high voltage switch or relay device is provided. This device can switch high voltages while using relatively low electrostatic operating voltages. The MEMS device compri...
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JP3368304B2 |
To provide an electrostatic microrelay to be driven by a low drive voltage so as to obtain a desired contact pressure. A base 10 is formed with a fixed electrode 12 at a central part of a top surface thereof, and a fixed contact 13 is ar...
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JP2002539624A |
A memory element for a flash memory including a first element made from electrically conductive material and having a stable position, an electrically conductive floating gate for storing charge, and means for urging the element from the...
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JP2002537630A |
A microstructure relay is provided, having a body that includes upper and lower portions. The lower portion is formed from a substrate, and the upper portion is formed on the substrate to avoid bonding of the lower portion to the upper p...
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JP2002534764A |
An electrostatic actuator and drive configuration device for use in a system requiring a long term ON state operation. The device includes a first electrostatic actuator positioned to operate in the system requiring the long term ON stat...
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JP2002270462A |
To provide a manufacturing process and materials for a hybrid communication element which is inexpensive and highly reliable by using in combination an integrated passive element for high-frequency communication and a passive element wit...
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JP2002237245A |
To provide a switching element having no deformation in a bridge electrode part and excellent switching performance.This switching element 30 is equipped with an insulating substrate 12 comprising a glass base and the like, a substrate s...
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JP2002170470A |
To provide a semiconductor micro relay of vertical open/close type together with its manufacturing method, which is manufactured in a relatively simple manufacturing process with no constraint on a structure design.There are provided a s...
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JP2002100276A |
To provide a small machine type switch and a relay having a contact with high reliability.A holding electrode having the same shape as the deflection shape of a beam is provided to keep the beam's deflection shape by an electrostatic for...
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JP2002075156A |
To realize high impedance and low-voltage drive, when a switch is off.An upper electrode 4, a lower electrode 6, a contact electrode 7 and a signal wire 8 are disposed, in such a manner that a shortest distance between the contact electr...
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JP2002036197A |
To realize a method and a device for controlling a micro machine element capable of using the voltage of low level with an actual method.In the method for controlling at least one micro machine element, a first control signal and a secon...
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JP2001347500A |
To provide a manufacturing method of micromachine in which the freedom of selection of a substrate is increased by a novel method to allow the use of an inexpensive substrate and also allow the manufacture of a structure having a large d...
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JP3224391B2 |
PCT No. PCT/DE92/00573 Sec. 371 Date Feb. 4, 1994 Sec. 102(e) Date Feb. 4, 1994 PCT Filed Jul. 14, 1992 PCT Pub. No. WO93/03385 PCT Pub. Date Feb. 18, 1993.An acceleration sensor is used in particular for recognizing an impact experience...
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JP2001291463A |
To obtain a high reliability and an excellent characteristic of a switch for switching an electrical signal such as a high frequency signal used flexure of a membrane. A contact electrode 9 is formed on the membrane 3, input/output conta...
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JP2001514434A |
An apparatus and method for a micromechanical electrostatic relay that includes a base substrate and a carrier layer deposited onto the base substrate. The carrier layer includes an armature and stationary-contact spring tongues that eng...
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JP3207161B2 |
To extend the life and improve the mechanical reliability by providing a circuit board for forming a pivot point, a pin rotatably supported thereby, a beam rotatable between two positions, at least one pair of electric contacts and a fie...
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JP3197890B2 |
To provide a device for a high-integrated radio frequency transceiver allowing selection or change of a component deciding a different operation frequency. A switch 11 is formed by use of a micro electromechanical system (i.e., a fluctua...
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JP2001208766A |
To provide an acceleration detector which can act surely.This acceleration detector 1 is manufactured by a micro- machining technique. The detector 1 is provided with a fixed electrode 13 and a plurality of mobile electrodes 15a-15k havi...
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JP2001198897A |
To provide a hybrid integrated circuit having a MEMS relay flip-chip bonded to a CMOS chip. The CMOS chip is bonded to a MEMS microrelay to form a rigid electric connection between the chips, whereby highly integral electric transmission...
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JP3182301B2 |
PURPOSE: To provide a microstructure body which can electrically connect the micro structure body with an electrode pattern and a substrate without any limit in material used for the microstructure body and the substrate. CONSTITUTION: I...
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JP2001179699A |
To provide a microelectronic machine actuator device capable of double operation. This device comprises a first substrate 12, a first operation electrode 20 formed on the first substrate 12, a second substrate 52 formed spacially from th...
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JP2001143595A |
To provide a folded spring based on micro electro-mechanical RF switch. A micro electro-mechanical RF switch 10 is formed on a circuit board 12 by means of a micro platform 20 suspended by a spring suspension 22. The spring suspension ha...
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JP2001126603A |
To provide a micro machine switch with high performance that may be produced in high volume at low cost. A flexible elongated member is mounted on a substrate by means of a support member arranged near a gap thereon. A contact electrode ...
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JP2001111131A |
To provide a magnetic function element, in which the direction or magnetization of a magnetic thin film can be changed over with god efficiency by an electrical input, and to provide a magnetic function apparatus which uses the magnetic ...
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JP2001076605A |
To provide an integrated microswitch, capable of being turned on or off reliably even by small attraction force without causing a breakage accident of a moving plate by generating a force between one end of the moving plate supported in ...
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JP2001067964A |
To secure a tunnel effect, to prevent welding of contacts and transition of the contact points without increasing contact resistance, and to prevent the degradation with the lapse of time by isolating the contacts from oxygen by covering...
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JP2001068006A |
To provide a relay, securing initial gap required for insulation and enhanced in contact pressure without increasing the drive voltage by composing a movable board with a first moving piece cut out by forming a slit and a second moving p...
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JP3139413B2 |
To increase the electrostatic attraction between both electrodes, eliminate the concurrent use of piezoelectric drive, miniaturize a micro-relay, increase sensitivity, reduce powder consumption, and improve productivity by molding the fi...
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JP2001052587A |
To form a substrate from a silicon wafer, realize a desired isolation characteristic and insertion loss characteristic even when processing a high-frequency signal, and prevent generation of unnecessary radiation. This microrelay has an ...
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JP2001502247A |
A bistable electrostatic actuator with pneumatic or liquid coupling. The actuator has enclosed metallic electrodes. It can be used for a microvalve or micropump. The actuator has buckled membrane sections in pairs and curved substrate el...
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JP3137112B2 |
To provide a simple structure so as to reduce insertion losses of a micromachine. This micromachine is provided with first and second high frequency signal lines 1b and 1a, a cantilever 11 fixed to the end of the first high frequency sig...
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JP3137108B2 |
To reduce insert losses of a micromachine switch and to enhance high frequency characteristics of a circuit using the micromachine switch. This micromachine switch comprises a driving means 12 for displacing a contact 11 according to a c...
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JP2001035288A |
To form a projection part having a small line width, even in the narrow area of a contact surface to provide a surface structure superior in dissociating property by forming an etching mask with the use of the difference in oxidation rat...
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JP2001023497A |
To cut off electrostatic attraction generated between a printed wiring serving as an output wire and a movable electrode so as to prevent an error of the movable electrode by laminating a single conductive thin film in at least a part of...
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JP2001014997A |
To provide a contact structure that has high contact reliability and good electric connection with a signal line by providing at least one of contacts with a projection made of conductive material on the signal line formed on a substrate...
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JP2001014998A |
To manufacture the relay easily, inexpensively, and with satisfactory yield by constructing a fixed electrode with a first fixed electrode and a second fixed electrode, and applying voltage with various polarities.Voltage is applied to p...
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JP3119255B2 |
To operate at low driving voltage and increase breakdown voltage characteristics of an insulator film by forming a region from a connecting part with a supporting member to only the position facing a bottom electrode of a beam member wit...
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JP3112001B2 |
To suppress deterioration of a reflection characteristic at the ON time, and simultaneously to improve an isolation characteristic at the OFF time, by making a moving element have at least two projecting parts formed by notching the end ...
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