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JP6242160B2 |
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JP6243668B2 |
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JP6233581B2 |
Provided is an ultrasonic sensor including a piezoelectric elements arranged along a first direction and a second direction on a vibration plate, an insulation layer, and conductive lines. Each piezoelectric element including a first ele...
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JP6235902B2 |
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JP6234641B1 |
An ultrasonic transducer is provided with the drive unit attached to the perimeter of a bolt in the state where it is inserted between the tip side block and the end face side block about the direction in alignment with a longitudinal ax...
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JP6229653B2 |
The present invention is a piezoelectric composition and a piezoelectric element using the piezoelectric composition, the composition being characterized by: having a Perovskite structure represented by general formula ABO3; being repres...
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JP6232124B2 |
Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in conne...
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JP6218279B2 |
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JP6219577B2 |
The invention relates to a method of manufacturing an ultrasound transducer (13) for use in an ultrasound imaging device (10), an ultrasound transducer manufactured according to the method and an ultrasound probe comprising at least one ...
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JP2017192143A |
To provide ultrasonic transducers, especially, ultrasonic transducers used for medical imaging.An ultrasonic transducer includes a backing element, an active element over the backing layer, and a matching element over the active element,...
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JP6214054B2 |
An electret-structure encompasses a fluorine-resin film 21, an electrode 22 formed on one surface of the fluorine-resin film 21, and a silica layer 21 formed on another surface of the fluorine-resin film 21. The silica layer 21 is implem...
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JP6214401B2 |
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JP6214333B2 |
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JP6211661B2 |
A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing th...
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JP6209041B2 |
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JP6209537B2 |
The present invention relates to a method of manufacturing a capacitive micro-machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectri...
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JP6208933B2 |
A composite ceramic transducer structure for use in the construction of an ultrasound probe includes a substrate and a plurality of piezoelectric transducer posts. The plurality of piezoelectric transducer posts are controllably formed o...
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JP6199076B2 |
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JP2017163183A |
To provide an ultrasonic element array that can have higher resistance against moisture and voltage even in a layout where wires intersect.An ultrasonic element array 1 includes: a first piezoelectric element 3, a second piezoelectric el...
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JP2017157664A |
To provide a piezoelectric thin film which is capable of being easily manufactured and whose crystal structure orientation is controlled, a piezoelectric element with excellent piezoelectric characteristics, and an ultrasonic probe and a...
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JP2017153789A |
To reduce manufacturing cost by downsizing a housing and also simplifying an assembly process.An ultrasonic probe manufacturing method assembles an ultrasonic probe including a probe substrate on a first main surface of which laminated o...
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JP6186696B2 |
An ultrasonic measurement device includes an ultrasonic transducer device, a flexible substrate and an integrated circuit device. The ultrasonic transducer device has a substrate, an ultrasonic element array, a plurality of signal electr...
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JP6187684B2 |
For producing a structured coating, or for carefully lifting off a coating over a sensitive region, it is proposed that a release film be applied and structured under the coating in the region which is not to be coated. In a release step...
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JP6190387B2 |
The present invention relates to a method of manufacturing a capacitive micro- machined transducer (100), in particular a CMUT, the method comprising depositing a first electrode layer (10) on a substrate (1), depositing a first dielectr...
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JP6189033B2 |
Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic tr...
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JP6183599B2 |
A method of manufacturing a piezoelectric element includes a first electrode, a piezoelectric layer, and a second electrode, in which unevenness on one surface of the piezoelectric layer is formed by forming an oxidizable metal layer on ...
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JP6185988B2 |
The present invention relates to a wafer (100) being subdivided and separable into a plurality of dies. Each die (110) comprises an array of capacitive micro-machined transducer cells (1). Each cell comprises a substrate (10) comprising ...
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JP6184534B2 |
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JP6184282B2 |
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JP6181644B2 |
A process for manufacturing a high-temperature ultrasonic transducer, said transducer comprising a steel or metal top electrode, a piezoelectric converter, a steel or metal support ensuring the interface between the converter and the pro...
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JP2017139432A |
To provide a method for manufacturing a piezoelectric element capable of forming a highly columnar fine structure.A method for manufacturing a piezoelectric element including a three-dimensional structure group having a plurality of thre...
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JP6177375B2 |
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JP6172393B2 |
A method can be used for producing a microelectromechanical transducer. A plurality of microelectromechanical transducers are produced on a single wafer. Each transducer includes a diaphragm. The wafer is divided into at least a first an...
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JP6173010B2 |
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JP6168846B2 |
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JP6164885B2 |
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JP2017519376A |
Provided are a thin film (2) for manufacturing a vibrating membrane (5), a method for manufacturing the vibrating membrane (5), and a composite vibrating membrane. The thin film (2) is formed of an MCPET material, the MCPET material is a...
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JP6156387B2 |
The present invention contributes to transmitting a highly directional acoustic wave(s) with high efficiency. An electroacoustic transducer comprises a piezoelectric vibrator; a casing being provided with a predetermined space from the p...
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JP2017117981A |
To provide a piezoelectric element capable of increasing a driving frequency to a high frequency, a piezoelectric module, an electronic device, and a method of manufacturing a piezoelectric element.An ultrasonic transducer 20 includes: a...
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JP6154438B2 |
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JP6151541B2 |
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JP2017108246A |
To provide a fiber resin composite sheet which is superior in endurance and moldability while having an excellent elastic modulus and internal loss value.A fiber resin composite sheet comprises an uncrimped fiber made of an aromatic poly...
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JP2017108226A |
To attain downsizing, facilitation of manufacture, and reduction of cost and to also widen a temperature use range.An acoustic port 18 is formed on a silicon first substrate (first wafer) 16, and a back chamber 19 is formed on a silicon ...
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JP6147138B2 |
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JP6148726B2 |
A multi-layered laminate for producing membranes for electroacoustic transducers, comprises a first layer of a polyether ether ketone film having a heat of crystallisation of at least 15 J/g, a second layer (of a thermoplastic plastic fi...
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JP6141551B2 |
An ultrasound transducer according to the present invention includes: a plurality of piezoelectric elements; a substrate configured to perform input and output of an electric signal with respect to the piezoelectric elements; a plurality...
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JP6141826B2 |
CMUT devices are used in many applications e.g. for ultrasound imaging and pressure measurement. These devices operate by sensing a change in capacitance caused by deflection of a membrane (32) comprising one of a pair of electrodes in t...
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JP2017098781A |
To provide a piezoelectric device capable of preventing unevenness of performance caused from anisotropy of a silicon wafer.The piezoelectric device includes: a piezoelectric body; and a vibration plate 53 formed of a single crystal sili...
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JP6135387B2 |
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JP2017092097A |
To provide a technique capable of improving the conversion efficiency of piezoelectric element when converting an electricity into a physical movement.The piezoelectric element includes: a piezoelectric body; and a diaphragm which uses a...
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