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JP2019046948A |
To provide a method of manufacturing a piezoelectric element in which columnar fine three-dimensional structures can be easily arranged at narrow intervals.The method of manufacturing a piezoelectric element 102 in which a plurality of c...
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JP2019041260A |
To provide a method for manufacturing a columnar structure to achieve both of an insulating property and the shapability enough to mold a columnar structure without a defect, thereby complying with the need for forming a transparent colu...
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JP6484343B2 |
The present invention discloses a manufacturing method of an integrated structure of a MEMS microphone and a pressure sensor, which comprises the following steps: depositing an insulating layer, a first polycrystalline silicon layer, a s...
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JP6476321B2 |
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JP6471242B2 |
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JP6450416B2 |
In an ultrasonic transducer manufacturing method, an ultrasonic device is mounted on a substrate, and a protective film having an acoustic matching layer thereon is prepared. Then, the protective film having the acoustic matching layer t...
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JP6450014B2 |
Provided are: an electroacoustic conversion film which is capable of reproduction with a sufficient sound volume and has high heat dissipation properties, while being suppressed in sound pressure change over time; a method for producing ...
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JP6448081B2 |
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JP2018537034A |
The present invention relates to a composition in the form of a sheet or layer, comprising a layer of an aromatic polymer and a layer of metal that adheres to at least one surface of the sheet of polymer, and its use. [Selection diagram]...
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JP6436530B2 |
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JP6438444B2 |
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JP6429711B2 |
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JP6431984B2 |
Provided are an electroacoustic transduction film capable of reproducing a sound with a sufficient sound volume at a high conversion efficiency, a manufacturing method thereof, an electroacoustic transducer, a flexible display, a vocal c...
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JP6430377B2 |
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JP2018186409A |
To provide a manufacturing method for a sacrificial layer type CMUT in which a sacrifice layer type etching opening is sufficiently sealed while an etching rate is hardly reduced.A method for manufacturing a sacrificial layer type CMUT i...
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JP6426620B2 |
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JP6422991B2 |
Disclosed is a method of manufacturing a device (1) comprising a plurality of micro-machined ultrasonic transducer cells (100) in a first region (10) on a substrate (30) and a plurality of interconnects (200) in a second region (20) on s...
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JP6422300B2 |
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JP2018533246A |
Methods, systems, computer-readable media, and devices for high density microelectromechanical systems (MEMS) are presented. In some embodiments, the method for manufacturing a microelectromechanical device on a substrate can include the...
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JP6418556B2 |
Provided is a speaker diaphragm being able to reduce disturbance of sound pressure frequency properties of a high-tone range including an extremely high-tone range while reducing a manufacturing cost, a speaker including the speaker diap...
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JP6419835B2 |
Techniques and mechanisms to provide mechanical support for a micromachined piezoelectric transducer array. In an embodiment, a transducer array includes transducer elements each comprising a respective membrane portion and a respective ...
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JP6416232B2 |
Disclosed is a method of manufacturing a capacitive micro-machined ultrasonic transducer (CMUT) device comprising a first electrode (112) on a substrate (110) and a second electrode (122) embedded in an electrically insulating membrane, ...
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JP6414605B2 |
A MEMS microphone with improved sensitivity and a method for producing such a MEMS microphone are disclosed. In an embodiment the MEMS microphone includes a carrier substrate, a capacitor having two electrodes, a substrate-side anchor an...
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JP6412598B2 |
A microphone and a method for manufacturing a microphone are disclosed. In an embodiment the microphone includes a substrate, a transducer element defining a front volume and a lid arranged such that the transducer element is arranged be...
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JP6405276B2 |
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JP6402800B2 |
The present invention is a piezoelectric composition and a piezoelectric element using the piezoelectric composition, the composition being characterized by: having a Perovskite structure represented by general formula ABO3; being repres...
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JP6402983B2 |
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JP2018152740A |
To provide a speaker diaphragm having satisfactory physical balance between elasticity modulus and internal loss.The speaker diaphragm includes: a base material layer (1A) molded in a shape of the diaphragm; and a coating layer (1B) cons...
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JP2018152817A |
To increase the production efficiency of a vibration plate superior in sound quality and heat resistance.A sheet 1 for a vibration plate comprises a release sheet 10, a first layer 20 including an uncured liquid silicone composition, and...
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JP2018149015A |
To provide a high aspect-ratio structure manufacturing method allowing for further reduction of the occurrence of sticking, an ultrasonic probe manufacturing method and a high aspect-ratio structure, and an X-ray imaging apparatus.A high...
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JP6394932B2 |
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JP6396237B2 |
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JP6395391B2 |
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JP6393930B2 |
[Problem] To reduce the size and increase the pressure detection sensitivity of a semiconductor pressure sensor. [Solution] At least two deep indentations or through holes are formed adjacent in the thickness direction of a semiconductor...
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JP6395390B2 |
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JP6397073B2 |
The invention discloses a silica gel vibrating diaphragm forming method and a silica gel vibrating diaphragm prepared by adopting the same. The silica gel vibrating diaphragm forming method comprises the steps of: providing a hot pressin...
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JP2018148435A |
To provide an electro-acoustic transducer which inhibits deterioration and variations of frequency characteristics, and to provide a manufacturing method of the electro-acoustic transducer and an electro-acoustic conversion device.An ele...
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JP6390423B2 |
An acoustic sensor is provided for improving shock resistance performance, along with a method for manufacturing the acoustic sensor. In the acoustic sensor, a fixing plate is provided by a semiconductor manufacturing process, a frame wa...
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JP6388833B2 |
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JP6384260B2 |
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JP6381195B2 |
A capacitance type transducer includes a plurality of cells each having a structure in which a vibrating film is supposed so as to be vibrated. The vibrating film includes: a second electrode formed so that a gap is interposed between th...
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JP2018129402A |
To provide a piezoelectric element and a manufacturing method therefor capable of increasing an amount of displacement of a diaphragm by controlling an initial deflected position to an upper convex structure by a piezoelectric layer and ...
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JP6365853B2 |
A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact stru...
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JP6365690B2 |
A method for manufacturing a piezoelectric device that includes a substrate and a vibration portion that can include a membrane or a beam that is directly or indirectly supported by the substrate and arranged above the substrate. Moreove...
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JP6365726B2 |
To provide an ultrasonic transducer device avoiding an increase in wiring resistance while having a piezoelectric film for each vibration film.A plurality of vibration films 24 is disposed in an array on a substrate 21. On the plurality ...
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JP6364900B2 |
An energy converter (100, 200, 300, 400, 500) includes a permanent magnet (20, 70) and a diaphragm (10, 60). The permanent magnet (20, 70) is fixed to a predetermined area. The diaphragm (10, 60) is disposed on the permanent magnet (20, ...
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JP6361897B2 |
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JP6363097B2 |
An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on th...
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JP6362741B2 |
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JP6358795B2 |
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