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JP2022147357A |
To improve wide-band characteristics of an ultrasonic transducer.In an ultrasonic transducer, a periphery of each mobile film 15 where an electromechanical transducing element 13 consisting of a lower electrode layer 13c, an electromecha...
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JP2022542398A |
A loudspeaker transducer diaphragm or cone (e.g., 201, 301 or 401) extends distally from a major forward or distal surface 230 to allow stiffening and break-up of resonant vibration modes during loudspeaker use. Equipped with an arcuate ...
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JP7141934B2 |
A highly-sensitive ultrasonic transducer with good yield is provided. The ultrasonic transducer includes a cavity layer, a pair of electrodes positioned above and below the cavity layer, insulating layers disposed above and below each of...
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JP2022132883A |
To provide a piezoelectric vibrator having higher dielectric characteristics and piezoelectric characteristics and also having good manufacturing yield, and a manufacturing method thereof.A piezoelectric vibrator includes a rectangular s...
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JP3239024U |
A chamois leather, which has poor plasticity and is difficult to mold, is relatively easily molded into a roll while maintaining the performance of the edge. A speaker edge oscillating portion 6 formed by forming a substantially annular ...
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JP7132808B2 |
To provide a transducer and a manufacturing method thereof that can facilitate connection between an electrode and a lead wire.A transducer 1 includes a dielectric layer 11, a first electrode sheet 12 including a plurality of first throu...
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JP7131746B2 |
To provide a method of manufacturing a microphone device having excellent mass productivity.The method of manufacturing a semiconductor device includes the steps of: mounting a plurality of microphone elements 7 on a mounting substrate 1...
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JP7125004B2 |
To provide a MEMS element having high sensitivity.This MEMS element has a slit 5 which is formed in a part of a vibration film 3 fixed to a handle substrate 1, and comprises a vibration area having a free end. The vibration area has the ...
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JP7120543B2 |
To provide a high-sensitivity MEMS element in which the effect of tensile stress from a support film is reduced.A gap 13 is provided between a fixed electrode 5 and a support film 7 to have a structure in which at least one connection po...
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JP7117669B2 |
A loudspeaker including a magnetic circuit; a voice coil body; a diaphragm attached to the voice coil body; a housing which accommodates the magnetic circuit and the voice coil body and to which an outer circumferential portion of the di...
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JP7109654B2 |
An ultrasound transducer includes: a flexible board configured to receive and output an electrical signal through a signal line; a plurality of piezoelectric devices that are electrically connected to the board and are aligned in a row, ...
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JP2022531856A |
The electrostatic transducer, the diaphragm for it (2), and the corresponding manufacturing method are disclosed. The electrostatic transducer is preferably for use in an automobile. The composite laminated diaphragm (2) is provided with...
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JP2022101148A |
To provide a backing material having an improved attenuation rate of ultrasonic waves while maintaining thermal conductivity.A backing material for an ultrasonic probe according to the present invention includes a carbonaceous matrix tha...
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JP7092153B2 |
A sound generator includes a sound generating body, a base, a protection wall, and an erected wall. The sound generating body includes a diaphragm and a driving portion. The base includes a base tubular portion and a partition wall defin...
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JP7091699B2 |
An ultrasonic sensor includes a vibration plate that includes a vibration portion and is formed of a resin; a wall portion that is provided on the vibration plate, surrounds the vibration portion and is formed of a resin; and a piezoelec...
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JP2022076783A |
To provide a manufacturing method of efficiently forming an element at low cost in an ultrasonic transducer array constituting a parametric speaker, and realize an operating temperature range (high temperature characteristic) required un...
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JP2022064608A |
To provide a curable composition for an impact absorbing material, which gives a cured product having impact absorbing ability and excellent adhesiveness.The curable composition for an impact absorbing material is a curable composition w...
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JP7048030B2 |
To provide a method for stably manufacturing an ultrasonic transducer capable of emitting high-frequency ultrasonic waves.An ultrasonic transducer 1 is formed by maintaining mechanical strength by leaving a part of a piezoelectric substr...
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JP7041532B2 |
A backing member includes: a resin body including a lower surface and an upper surface opposite to each other; a plurality of leads each of which extends in a first direction from the lower surface toward the upper surface, and that are ...
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JP2022045715A |
To obtain a diaphragm for a speaker with high sound pressure, and a speaker.A diaphragm 1 for a speaker includes a reinforcing fiber layer 10 in which carbon fibers 11 are randomly oriented in a thermoplastic resin, and a thermoplastic r...
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JP2022038236A |
To provide a manufacturing method of an ultrasonic transducer that can easily improve manufacturing efficiency and yield.In an ultrasonic transducer, in a backing material mounting step, a backing material is placed on the support surfac...
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JP2022025321A |
To reduce the damage given to a back layer while suppressing a lateral vibration mode of an oscillator.An ultrasonic probe according to an embodiment includes an oscillator, an acoustic matching layer, and a back layer. The oscillator in...
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JP7015413B2 |
Provided is an electrostatic transducer that makes it possible to connect a lead wire to a flexible electrode sheet reliably, easily, and at low cost. An electrostatic transducer (1) is provided with: a flexible electrode sheet (12); a l...
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JP7008593B2 |
The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurali...
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JP2022509066A |
The capacitive microfabrication ultrasonic transducer includes a lower electrode, an upper electrode, and a membrane arranged between the lower electrode and the upper electrode and attached to the upper electrode. Anchors are connected ...
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JP6992292B2 |
A method according to the present invention includes: a step of producing substrate 101 by using a MEMS technique to form multiple diaphragms 22a in a substrate by forming piezoelectric material layer 103 on one surface of the substrate ...
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JP2022001403A |
To provide a method for manufacturing a device which can adjust cavity dimension, and on the other hand, maintains membrane integrity, and comprising the membrane suspended above the cavity.A method for manufacturing a microelectronic de...
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JP6985575B2 |
An acoustic wall includes a plurality of such absorbers produced by a repetitive structure opening through perforations, each receiving such a wafer, and a method of designing and manufacturing such an absorber or wall is also provided.
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JP6984009B2 |
A sound transducer, in particular for an ultrasonic sensor, is described, which includes a housing, at least one decoupling element and a functional group. The functional group includes a diaphragm cup and at least one electroacoustic co...
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JP2021535646A |
To make a conventional electrostatic transducer smaller and more mass-produced. A method of manufacturing a microelectrostatic transducer and such a device is described. Microelectrostatic transducers are integrated component converters ...
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JP2021168497A |
To provide a thin microphone, a packaging method used when manufacturing the same, and an electronic apparatus.A microphone 1 includes a die 11 with a transducer, a frame body 12 having a hole 12A penetrating in the vertical direction an...
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JP2021164020A |
To provide an ultrasonic transducer allowed to be easily manufactured, and to provide a manufacturing method of the ultrasonic transducer.An ultrasonic transducer includes: a piezoelectric element 10 having electrodes 12, 13 on one princ...
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JP2021153293A |
To provide an electromechanical conversion element that has a high frequency and high resolution and can ensure appropriate sound pressure and reception sensitivity.In an ultrasonic transducer having a plurality of piezoelectric elements...
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JP2021141301A |
To provide a full automatic loudspeaker coil winding machine.A full automatic loudspeaker coil winding machine includes a device body which has a winding space installed on a right-side end face, and is characterized in that: the device ...
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JP6933499B2 |
To properly form a hole that becomes a passage between a sensitive part of a sensor and the outside, in a mold.A pin 223 of a metal die for primary molding is inserted and fitted in a through-hole 11 of a substrate 1 and in a state where...
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JP6931613B2 |
An integrated voice coil and cone assembly includes a cone assembly having a top diaphragm skin and a bottom diaphragm skin with a space between the top diaphragm skin and bottom diaphragm skin. The integrated voice coil and cone assembl...
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JP6914379B2 |
An ultrasound device includes: ultrasonic transducer cavities; a membrane comprising a silicon layer that seals the ultrasonic transducer cavities; electrode regions configured to control vibration of the membrane; and a complementary me...
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JP6908719B2 |
Provided are a resin composition for an acoustic matching layer; an acoustic matching sheet formed from the composition; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and...
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JP6904814B2 |
A method includes a step of forming a sacrificial layer on a first film, a step of forming a second film on the sacrificial layer, a step of forming an etching opening that extends through at least one of the first film and the second fi...
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JP2021516899A |
Aspects of the art described herein relate to ultrasonic transducer devices, including capacitive microfabrication ultrasonic transducers (CMUTs), and methods of forming CMUTs on ultrasonic transducer devices. In some embodiments, a firs...
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JP6899238B2 |
To provide a piezoelectric element in which an appropriate opening for making contact with a first electrode can be formed in a piezoelectric film.A piezoelectric element 4 includes: a first electrode 11; a first piezoelectric film 12 th...
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JP6891293B2 |
A sound transducer, in particular, for an ultrasonic sensor, includes a functional group, the functional group including a diaphragm cup and at least one electroacoustic transducer element. The sound transducer also includes a housing. T...
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JP6885828B2 |
To provide an MEMS element that is not deformed even when subject to sudden heating or sudden cooling at an assembly step or a mounting step, able to have a strong structure and stable characteristics.An MEMS element comprises a structur...
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JP6887123B2 |
A diaphragm of a loudspeaker is composed of a plate-shaped diaphragm body and a ring-shaped reinforcing part, both of which are bonded to each other. The reinforcing part is provided with a groove that is recessed from a joint surface of...
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JP2021082734A |
To control a stress in a thin layer to be a desired value while simplifying production processes.In a production method of a wafer for forming an element, a semiconductor wafer 100 having a plurality of chip formation regions 101 is prep...
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JP6874943B2 |
To provide a MEMS element capable of achieving an improvement in sensitivity and miniaturization at the same time, and a method of manufacturing the same.A MEMS element in which a movable electrode 3 and a fixed electrode 5 formed on a s...
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JP6873843B2 |
Provided is an electrostatic transducer (1) in which an electrostatic unit (10) is formed so as to be flat and wound into a roll, from a first laminate sheet (110) and a second laminate sheet (120). The first laminate sheet (110) is prov...
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JP6869983B2 |
Probe assembly includes a modular device configured to detect external signals or emit energy. The modular device has a device array that includes at least one of electrical contacts or optical fiber ends. The probe assembly also include...
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JP6863545B2 |
To provide a MEMS element of which breakage is prevented, and a method for manufacturing said MEMS element.The MEMS element is provided in which an air gap is formed by arranging a silicon substrate 1 comprising a back chamber 11, and a ...
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JP6851368B2 |
A membrane hydrophone for analyzing high frequency ultrasound transducers has a piezoelectric membrane with electrode patterns created on the surface of the membrane. In one embodiment, the electrode patterns are doubled on each side of ...
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