Title:
リードフレーム
Document Type and Number:
Japanese Patent JP4655300
Kind Code:
B2
More Like This:
JP4326609 | Method for manufacturing semiconductor devices |
JPS5336468 | PACKAGE FOR INTEGRATED CIRCUIT |
JP2004186474 | DAM BAR CUTTING APPARATUS |
Inventors:
Hideo Nakamura
Yasuo Nagasawa
Shuichi Sugimoto
Yasuo Nagasawa
Shuichi Sugimoto
Application Number:
JP2003378523A
Publication Date:
March 23, 2011
Filing Date:
November 07, 2003
Export Citation:
Assignee:
tdk lambda corporation
International Classes:
H01L23/50; H01L25/18; H01L25/04
Domestic Patent References:
JP10207467A | ||||
JP2001077276A | ||||
JP11307675A | ||||
JP2002076175A | ||||
JP53023071A | ||||
JP11150225A | ||||
JP4321261A | ||||
JP2003282808A | ||||
JP11066968A | ||||
JP11097607A | ||||
JP10303354A | ||||
JP2020368U | ||||
JP61027662A | ||||
JP5190721A |
Attorney, Agent or Firm:
Mamoru Ushiki