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Title:
セラミック焼結板、及びセラミック焼結板の製造方法
Document Type and Number:
Japanese Patent JP7186930
Kind Code:
B1
Abstract:
本開示の一側面は、８００Ｈｚ～１ＭＨｚの間で周波数を連続的に変化させながら１Ｖの交流電圧を印加したときに生じる誘電損失ε”の最大値が１×１０－２以下である、セラミック焼結体を提供する。

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Inventors:
Yuta Tsugawa
Yun River
Seiji Yano
Application Number:
JP2022535196A
Publication Date:
December 09, 2022
Filing Date:
February 08, 2022
Export Citation:
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Assignee:
Denka Co., Ltd.
International Classes:
C04B35/587
Domestic Patent References:
JP2002201075A2002-07-16
JP2000335974A2000-12-05
JP2006008493A2006-01-12
JP2018020929A2018-02-08
JP2009179557A2009-08-13
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Takeshi Nakatsuka



 
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