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Patent Searching and Data


Title:
CUTOFF PIECE RECOVERY APPARATUS BY LASER BEAM MACHINING
Document Type and Number:
Japanese Patent JP2006110444
Kind Code:
A
Abstract:

To provide a cutoff piece recovery apparatus by laser beam machining, which recovers a cutoff piece produced when a flexible machining subject is machined by a laser beam, and which needs no new recovery apparatus, and enables economically an improvement in a recovery efficiency of punched pieces such as paper.

A recovery body 24 is partitioned into an air pass area 26 and a recovery area 29 (30) by a filter part 25, the recovery area being divided into a first recovery area 29 and a second recovery area 30 or integrated by a first movable partitioning part 28 which is a first partitioning means. When the cutoff piece is introduced, the first movable partitioning part 28 partitions the recovery area, and when the recovery to the second recovery area 30 is carried out, the first movable partitioning part 28 forms an integral recovery area.


Inventors:
HIROHATA WATARU
Application Number:
JP2004299638A
Publication Date:
April 27, 2006
Filing Date:
October 14, 2004
Export Citation:
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Assignee:
TOPPAN FORMS CO LTD
International Classes:
B08B5/00; B01D46/42
Attorney, Agent or Firm:
▲高▼橋 寛