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Title:
EPOXY ADHESIVE, CAST-MOLDED PRODUCT USING THE SAME, AND METHOD FOR PRODUCING THE CAST-MOLDED PRODUCT USING THE SAME
Document Type and Number:
Japanese Patent JP2008038070
Kind Code:
A
Abstract:

To provide an epoxy adhesive giving high long-term adhesive force while effectively suppressing the increase in residual stress associated with the difference of coefficient of thermal expansion between a metallic part and an epoxy resin in cooling, to provide a cast-molded product using the epoxy adhesive, and to provide a method for using the epoxy adhesive.

The epoxy adhesive comprises a main component comprising an epoxy compound having in one molecule at least two epoxy groups and rubber particles smaller than 1m in primary size and an epoxy-curing agent incorporated in the main component.


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Inventors:
NAKANO TOSHIYUKI
Application Number:
JP2006216609A
Publication Date:
February 21, 2008
Filing Date:
August 09, 2006
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
C09J163/00; C09J11/08; C09J151/00
Domestic Patent References:
JP2006169446A2006-06-29
JPH07138550A1995-05-30
JP2003020379A2003-01-24
JPH08100163A1996-04-16
JP2005239921A2005-09-08
JPH11199849A1999-07-27
JPH11148059A1999-06-02
JPH10292165A1998-11-04
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi
Akio Saruwatari
Junichi Furukawa



 
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