To provide an epoxy resin composition which gives cured articles not containing bubbles therein and having heat resistance and moisture resistance in an excellent balance and is especially useful as a sealing material for LED emitting short wavelength light.
This epoxy resin composition comprises the following components (A), (B) and (C). The component (A) is an epoxy resin containing 50 to 100 pts. mass of a hydrogenated epoxy resin which is obtained by directly hydrogenating an aromatic epoxy resin and has an aromatic ring hydrogenation rate of 90 to 100 %. The component (B) is an acid anhydride curing agent containing 20 to 100 pts. mass of an acid anhydride which is obtained by hydrogenating an acid anhydride compound obtained by the Diels-Alder reaction of an 8 to 12C dienic hydrocarbon and/or a triene hydrocarbon with maleic anhydride and produces carbon dioxide in an amount of ≤2,000 μg / g, when mixed with a curing accelerator and heated at 200°C for 10 min. The component (C) is a curing accelerator.
| JP2000169555 | SEMICONDUCTOR UNIT |
| JP3891842 | EPOXY RESIN COMPOSITION |
| WO/2020/255749 | COMPOSITION FOR SEALING, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE |
Akira Inoue
Hiroshi Nakamoto