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Title:
COMPOSITION FOR SEALING, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/255749
Kind Code:
A1
Abstract:
The present disclosure provides a composition for sealing capable of manufacturing a cured product less likely to warp during molding. The composition for sealing contains an epoxy resin (A) including an epoxy resin (a) having a fused-ring hydrocarbon skeleton, a curing agent (B), and a copolymer (C) of a polysiloxane modified at both ends by an acid anhydride, and a polyalkylene glycol.

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Inventors:
IWATANI EMI
OGAWA KAZUTO
Application Number:
PCT/JP2020/022267
Publication Date:
December 24, 2020
Filing Date:
June 05, 2020
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/24; C08L63/00; C08L83/12; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
WO2018221373A12018-12-06
WO2009142065A12009-11-26
Foreign References:
JPH05230180A1993-09-07
JP2018168354A2018-11-01
JP2011195742A2011-10-06
Other References:
KAJI MASASHI: "Structures and properties of Epoxy Resins- Structures and properties of Naphtalene-based Epoxy Resins", SOCIETY OF SYNTHETIC TESIN INDUSTRY, 1994, pages 137 - 140, Retrieved from the Internet
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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