Title:
FORMING OF EMBOSSMENT
Document Type and Number:
Japanese Patent JP2783310
Kind Code:
B2
Abstract:
PURPOSE: The height of embossment is improved to be several times of the plate thickness of material to be worked by forming by a punch and knockout applying hydrostatic pressure under which the material is pressed to be deformed from the first forming stage.
CONSTITUTION: In a state in which the material to be worked 20 is held by a plate holder 1 and a die 2, the punch 3 projecting from a hole of the plate holder 1, the material 20 is pressurized by the punch 3 and when the material 20 is intruded in the hole 2A side of die 2, the knockout 4 is always applied with pressure against intrusion and an embossment is formed when the material is applied with hydrostatic pressure under which the material is pressed to be deformed. Accordingly, the part of the material 20 applied with hydrostatic pressure is pressed to be deformed, the plastic flow property of material is improved to uniform extend whole the material and a deeper embossment without breaking is formed. The embossment having 1.5 to 2 times of plate thickness of material is easily formed without preliminary forming.
More Like This:
Inventors:
KURAHASHI HIDEAKI
OSHIMA JUJI
YOKOI TOSHIHARU
OSHIMA JUJI
YOKOI TOSHIHARU
Application Number:
JP4984593A
Publication Date:
August 06, 1998
Filing Date:
January 28, 1993
Export Citation:
Assignee:
TOYOTA SHATAI KK
International Classes:
B21J5/02; B21J13/02; B44B5/00; (IPC1-7): B21J5/02; B21J13/02; B44B5/00
Domestic Patent References:
| JP5171263A | ||||
| JP6297724A | ||||
| JP111038A | ||||
| JP2112845A | ||||
| JP6210389A | ||||
| JP16557A | ||||
| JP5635964B2 | ||||
| JP4742030B2 |