Title:
GRINDING METHOD
Document Type and Number:
Japanese Patent JP2022045370
Kind Code:
A
Abstract:
To eliminate work of wheel replacement which occurs every time self grinding is performed.SOLUTION: A grinding device comprises: a first wheel mount fixed to a lower end part of a spindle; a second wheel mount which is rotatable with the first wheel mount, is movable along a longitudinal direction of the spindle, and has a flange part protruded outward relative to an outer periphery of the first wheel mount; and a movement mechanism for moving the second wheel mount. A grinding method using the grinding device, comprises: a holding surface grinding step for relatively lowering one of the first wheel mount and the second wheel mount, and grinding a holding surface of a chuck table by a holding surface grinding wheel; and a workpiece grinding step for relatively lowering the other of the first wheel mount and the second wheel mount, and grinding a workpiece held by the holding surface by a workpiece grinding wheel. In the method, the holding surface grinding step and the workpiece grinding step are selectively executed.SELECTED DRAWING: Figure 2
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Inventors:
SUDO YUJIRO
HARADA SHIGENORI
FUJIMURA TAKASHI
HARADA SHIGENORI
FUJIMURA TAKASHI
Application Number:
JP2020150935A
Publication Date:
March 22, 2022
Filing Date:
September 09, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B7/04; B24B45/00; B24B49/16; H01L21/304
Attorney, Agent or Firm:
Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano