Title:
HEAT RADIATION FIN MOLDING BODY CARRIER DEVICE
Document Type and Number:
Japanese Patent JP2022179989
Kind Code:
A
Abstract:
To provide a heat radiation fin molding body carrier device that can prevent deformation of a cylindrical standing part even when a feed pin tries to lift a base part of the cylindrical standing part during backward travel of a pitch feed mechanism.SOLUTION: A heat radiation fin molding body carrier device 100 carries, in a carrying direction, a heat radiation fin molding body 211A at a stage before being cutting into a prescribed length in the carrying direction after formation of a cylindrical standing part TK on a metallic thin plate in manufacture of a heat radiation fin 230 formed with the cylindrical standing part TK into which a refrigerant pipe is inserted. The carrier device 100 includes: a lower guide 110 which holds a bottom surface of the heat radiation fin molding body 211A and has a through hole 112 formed along the carrying direction at a plane position of the cylindrical standing part TK; a feed pin 130 housed in the through hole 112; a feed pin driving unit 140 for protruding and retracting the feed pin 130 from an upper surface of the lower guide 110, and reciprocally moving it in the carrying direction; and an upper guide 120 formed so as to be capable of abutting on an upper end surface JT of the cylindrical standing part TK.SELECTED DRAWING: Figure 3
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Inventors:
SHIOZAWA MICHIHIRO
HARASAWA TAKESHI
HARASAWA TAKESHI
Application Number:
JP2021086850A
Publication Date:
December 06, 2022
Filing Date:
May 24, 2021
Export Citation:
Assignee:
HIDAKA SEIKI KK
International Classes:
B21D43/22; B21D53/08
Domestic Patent References:
| JP5505911B2 | 2014-05-28 | |||
| JP2016198798A | 2016-12-01 | |||
| JP5915640B2 | 2016-05-11 | |||
| JP6523464B2 | 2019-06-05 |
Foreign References:
| WO2018073930A1 | 2018-04-26 |
Attorney, Agent or Firm:
Watanuki International Patent and Trademark Office