To fully adhere a solder to a terminal of electronic parts, even in the case of a high temperature solder.

This device comprises a solder liquid tank 11 equipped with a heater 13 for melting a high temperature solder 12, a through hole 15 which is formed in the solder liquid tank 11 and penetrates through in up/downward directions, a block 14 for soldering electronic parts 18 with the high temperature solder 12 guided to an upper part of the through hole 15 via the through hole 15, and a solder retaintion part 16 positioned around the upper part of the through hole 15 of the block 14.