To provide an inexpensive inkjet recording head excellent in heat radiation property in which the rear surface of a liquid ejection substrate and bumps are bonded under low pressure and a small heat resistance.
In the inkjet recording head configured to perform heat connecting of the rear surface of a recording element substrate H1101 to a wiring member and a heating member with the metal bumps H1105, the bonding is executed by filling a heat-conductive resin between the metal bumps H1105 and the rear surface of the recording element substrate to reduce the heat resistance of a junction interface between the recording element substrate and the metal bumps, improving a heat radiation characteristic from the recording element substrate to the wiring member and the heat radiation plate.
COPYRIGHT: (C)2008,JPO&INPIT
| JPH03164259 | LIQUID JET RECORDING HEAD |
| JP2005125638 | LIQUID JET HEAD, LIQUID JET DEVICE, AND METHOD OF MANUFACTURING LIQUID JET HEAD |
| JPS6342872 | INK JET RECORDING HEAD |
IWANAGA SHUZO
YAMAMOTO TERU
SAITO RIICHI
WATABE IKUTOMO
Yuichi Uchio