Title:
METHOD FOR INCREASING UNIFORMITY OF MECHANOCHEMICAL POLISHING USING ELECTROLYTIC CONDUCTOR LAYER
Document Type and Number:
Japanese Patent JP3186734
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for increasing uniformity of mechanochemical polishing, using an electrolytic conductor layer.
SOLUTION: In this method for increasing uniformity of mechanochemical polishing using an electrolytic conductor layer, upon formation of a conductor layer, the conductor layer is processed in an electrolytic process to decrease the thickness of the conductor layer and remove uneven parts on its surface, and thereafter the surface of the conductor layer is polished in a mechanochemical polishing process. The thickness of the conductor layer is decreased by the electrolytic process, thereby shortening the time necessary by the subsequent mechanochemical polishing process. At the same time, since charges 34 are concentrated on projected parts on the surface of the conductor layer, the electrolysis rate of the projected parts becomes faster than that of recessed parts thereon, unevenness on the conductor layer surface is improved. When the conductor layer is formed through electroplating, its efficiency is further improved.
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Inventors:
Chen Xuechung
Bear
Junwon Wu
roh hot iron
Bear
Junwon Wu
roh hot iron
Application Number:
JP11076999A
Publication Date:
July 11, 2001
Filing Date:
April 19, 1999
Export Citation:
Assignee:
Unihua Electronics Co., Ltd.
International Classes:
H01L21/768; H01L21/288; H01L21/304; H01L21/3063; (IPC1-7): H01L21/304
Domestic Patent References:
| JP9213803A | ||||
| JP2213500A |
Attorney, Agent or Firm:
Matsumoto Takemoto (4 outside)