MANUFACTURE OF SEMICONDUCTOR CHIP

Title:

MANUFACTURE OF SEMICONDUCTOR CHIP

Document Type and Number:

Japanese Patent JPH01175240

Kind Code:

A

Abstract:

PURPOSE:To prevent a breakage or a crack from being produced in each divided element by a method wherein a groove whose cross section is V-shaped is formed in a cutting margin between individual elements of a semiconductor wafer and the semiconductor water is divided along the groove. CONSTITUTION:An SiO2 protective film 12 is laminated on the surface of a semiconductor wafer substrate 11; a part corresponding to a cutting margin 13 is removed by an etching operation. Then, a region of the cutting margin 13 is etched by using an anisotropic etching solution such as hydrazine or the like; a groove 14 whose cross section is V-shaped is formed. A dicing saw can be inserted smoothly into the V-shaped groove 14; there is no danger that a breakage or a crack is produced in each adjacent semiconductor element.

More Like This:

JPH0241209	DIVIDING METHOD FOR SUBSTRATE OF SEMICONDUCTOR OR THE LIKE
JPH06295890	MACHINING METHOD FOR SEMICONDUCTOR WAFER
JP7034371	Semiconductor chip manufacturing equipment and semiconductor chip manufacturing method

Inventors:

UEDA JUN

Application Number:

JP33580687A

Publication Date:

July 11, 1989

Filing Date:

December 28, 1987

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHARP KK

International Classes:

B28D5/00; H01L21/301; H01L21/78; (IPC1-7): B28D5/00; H01L21/78

Attorney, Agent or Firm:

Shusaku Yamamoto

Previous Patent: PORTABLE REMOTE START TERMINAL FOR SPEECH SYSTEM

Next Patent: MASTER SLICE OF SEMICONDUCTOR DEVICE