MANUFACTURE OF TEST PIECE FOR DEFECT ADJUSTMENT OF SEMICONDUCTOR ELEMENT

Title:

MANUFACTURE OF TEST PIECE FOR DEFECT ADJUSTMENT OF SEMICONDUCTOR ELEMENT

Document Type and Number:

Japanese Patent JP2715290

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a manufacturing method of a test piece for defect adjustment of a semiconductor element which inspects only a die with a defective place in the state of a wafer wherein a semiconductor element is formed.
SOLUTION: The title method includes a process for searching for a defective place A generated in a pattern layer 12 of a wafer 10, a process for forming a photosensitive film 13 all over the pattern layer 12, a process for polishing a rear of a die until a hole whose diameter of an upper side is large and that of a lower side is small is shaped around a specified position in a rear of a die with the defective place A in the state of a wafer which is not separated to each die and a process for removing silicon residue remaining in a polishing part by etching.

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Inventors:

Kuchong-fe
Park Din

Application Number:

JP20924596A

Publication Date:

February 18, 1998

Filing Date:

July 19, 1996

Export Citation:

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Assignee:

Hyundai Electronics Industry Co., Ltd.

International Classes:

G01N1/32; G01N1/28; G01N23/225; H01L21/306; H01L21/66; (IPC1-7): H01L21/66; G01N1/32; G01N23/225; H01L21/306

Domestic Patent References:

JP5180739A
JP4316347A
JP5932842A

Attorney, Agent or Firm:

Eiichi Saito

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