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Title:
化合物半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5161759
Kind Code:
B2
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Inventors:
Atsushi Yamada
Application Number:
JP2008334794A
Publication Date:
March 13, 2013
Filing Date:
December 26, 2008
Export Citation:
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Assignee:
富士通株式会社
International Classes:
H01L21/3063; H01L21/205; H01L21/306; H01L21/338; H01L29/778; H01L29/812
Domestic Patent References:
JP2008109162A
JP11229199A
Foreign References:
WO2008096168A1
WO2006050469A1
Attorney, Agent or Firm:
Takayoshi Kokubun



 
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