Title:
半導体装置の作製方法
Document Type and Number:
Japanese Patent JP5639749
Kind Code:
B2
Abstract:
A wiring substrate is provided, including an insulating resin layer which is provided on both surfaces of a sheet-like fibrous body and with which the sheet-like fibrous body is impregnated, and a through wiring provided in a region surrounded by the insulating resin layer. The through wiring is formed using a conductive material, the conductive material is exposed on both surfaces of the insulating resin layer, the sheet-like fibrous body is positioned in the conductive material, and the sheet-like fibrous body is impregnated with the conductive material. A manufacturing method of the wiring substrate is also provided.
More Like This:
Inventors:
千田 章裕
青木 智幸
青木 智幸
Application Number:
JP2009134374A
Publication Date:
December 10, 2014
Filing Date:
June 03, 2009
Export Citation:
Assignee:
株式会社半導体エネルギー研究所
International Classes:
H05K1/11; H01L21/288; H01L21/3205; H01L21/336; H01L21/60; H01L21/768; H01L21/8247; H01L23/522; H01L27/115; H01L29/786; H01L29/788; H01L29/792; H05K1/03; H05K3/40