Title:
顕微鏡試料をレーザ切断するための方法および装置
Document Type and Number:
Japanese Patent JP4236844
Kind Code:
B2
Abstract:
The invention relates to a method and a device for laser cutting microscopic samples. The device for laser cutting microscopic samples comprises a microscope (1) having at least one lens (6) for observing a sample (12) that is to be cut The lens (6) defines an optical axis (14) and a lens aperture (34). A laser (4) is also connected to the microscope (1). The laser (4) generates a laser beam (41) that is injected into the lens (6) by means of at least one optical system (16). A diaphragm (18) is provided, which generates a dimmed laser beam (4b), whereby the laser aperture (36) generated by the lens (6) is smaller than the lens aperture (34) of the lens (6) itself.
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Inventors:
Gunzer, Michael
Weiss, Albrecht
Stenzel, Ludiger
Weiss, Albrecht
Stenzel, Ludiger
Application Number:
JP2001576426A
Publication Date:
March 11, 2009
Filing Date:
April 10, 2001
Export Citation:
Assignee:
Leica MicroJustems ZMS Gaem Behr
International Classes:
G01N1/06; G01N1/28; B23K26/00; B23K26/066; G01N1/04; G02B21/32
Domestic Patent References:
| JP11148887A | ||||
| JP5245675A | ||||
| JP10216966A | ||||
| JP62195277A | ||||
| JP60164487A | ||||
| JP63059875A |
Attorney, Agent or Firm:
Kato Asamichi
Kiuchi Uchida
Toshio Miyake
Kiuchi Uchida
Toshio Miyake