【発明の名称】半導体装置の製造方法

Title:

【発明の名称】半導体装置の製造方法

Document Type and Number:

Japanese Patent JP2577544

Kind Code:

B2

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Inventors:

NISHIZAWA JUNICHI
SUZUKI SOHEE

Application Number:

JP16482284A

Publication Date:

February 05, 1997

Filing Date:

August 08, 1984

Export Citation:

Assignee:

SHINGIJUTSU JIGYODAN
NISHIZAWA JUNICHI
SUZUKI SOHEE

International Classes:

H01L29/80; H01L21/205; H01L21/263; H01L21/268; H01L29/74; (IPC1-7): H01L21/205; H01L21/263; H01L29/74; H01L29/80

Domestic Patent References:

JP55130896A
JP449005B1

Other References:

【文献】日経エレクトロニクス,1981年11月9日号,第86~91頁

Attorney, Agent or Firm:

Kazuyuki Hirayama (1 person outside)

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