PURPOSE: To substantially nullify the occupation area of lead on the outside of sealing resin by employing the surface at the outer end of inner lead, as it is, as an external terminal,
CONSTITUTION: An intermediate material 4 is formed at the outer end of an inner lead 3 and a connecting piece 5 is formed through the intermediate material 4. Connecting pieces 5, intermediate members 4 and inner leads 3 for a plurality of semiconductor chips are integrated through a holding frame into a lead frame after resin sealing before cutting thereof with the connecting piece 5 constituting a part of the holding frame. Surface at the outer end of the inner lead is sealed such that the surface of sealing resin is exposed and the connecting piece 5 is also sealed with the resin 6. A solder plating layer 7 is then formed on the outer end surface of the inner lead 3 exposed to the surface of the sealing resin 6 and the solder plating layer 7 is connected, as it is as an external terminal, with a wiring film through a solder layer 7. Since the part of inner lead projecting from the sealing resin is cut off, occupation area of the lead on the outside of the sealing resin can be nullified.
| JPS6020943 | [Title of the device] Semiconductor device |
| JPH03211860 | SEMICONDUCTOR PACKAGE |
| JP2008034515 | ELECTRONIC APPARATUS AND PACKAGE |
KOJIMA AKIRA
NAGANO MUTSUMI
TAKAHASHI HIDEYUKI
