Title:
PACKAGING FILM AND HEAT SHRINKABLE FILM-WRAPPED WIRE BUNDLE
Document Type and Number:
Japanese Patent JP2023110584
Kind Code:
A
Abstract:
To provide a packaging film that has an excellent mechanical strength such as tear strength and tensile strength, also has a high shrinking rate, and reduces an amount of carbon dioxide emission by using a plant-derived polyethylene-based resin that is a renewable resource, as a raw material, and a heat shrinkable film-wrapped wire bundle.SOLUTION: There is provided a packaging film having a shrinkable layer made of a polyethylene-based resin composition containing a plant-derived polyethylene-based resin, wherein the shrinkable layer contains 10 wt.% or more of a plant-derived polyethylene resin, and a heat shrinkage rate at 120°C is 25% or more. The shrinkable layer preferably contains 20 wt.% or more of the plant-derived polyethylene resin. The shrinkable layer is uniaxially stretched, and a stretch ratio is preferably 1.1 times or more and 8 times or less.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
KAWAMOTO TAKASHI
Application Number:
JP2022012124A
Publication Date:
August 09, 2023
Filing Date:
January 28, 2022
Export Citation:
Assignee:
SUMIKASEKISUI FILM COLTD
International Classes:
B29C61/06; B29C61/02; B32B7/028; B32B27/32; B65D65/40; B65D71/08; B65D85/04
Attorney, Agent or Firm:
CLAIA PATENT ATTORNEYS CORPORATION
Previous Patent: battery case
Next Patent: Sputtering target and sputtering target manufacturing method
Next Patent: Sputtering target and sputtering target manufacturing method