To provide a grinding apparatus of a grinding and contact check integrated type and a grinding method thereof which improves the reliability of inspection by surely removing foreign matters by grinding and which extends the life of an inexpensive probe pin by reducing time for grinding so as to omit unnecessary grinding in addition.

The apparatus comprises a wafer stage 3 for vacuum chucking a wafer 2, a driving part 4 for moving the wafer stage 3 in (X, Y, X and θ) directions, and a grinding part 5 provided over the whole surface surrounding the wafer stage 3. A contact-resistance measuring part 11 for measuring contact resistance with a grinding layer 8 composed of a conductive film by applying a fixed voltage to the probe pin 10 is connected to a probe card 9. A grinding control part 12 provided with a mechanism for continuing and completing the grinding on the basis of data from the contact-resistance measuring part 11 is connected to the driving part 4.