Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2021070769
Kind Code:
A
Abstract:
To provide a resin composition that has high conductivity, gives sufficient dimensional stability against temperature changes, has a low thermal expansion coefficient, and does not cause a practical problem for injection molding, and provide a molded article.SOLUTION: Provided is a resin composition including: a polyacetal; conductive carbon black; graphite; and a specific polyacetal decomposition inhibitor, wherein the conductive carbon black has a dibutyl phthalate oil absorption of 180 ml/100 g or less, wherein the content of the polyacetal in the resin composition is 60 mass% or more, and wherein the content of the conductive carbon black in the resin composition is 16 mass% or more and 20 mass% or less.SELECTED DRAWING: None
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Inventors:
KOJIMA TAKAHIRO
Application Number:
JP2019199319A
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
CANON KK
International Classes:
C08L59/00; C08K3/04; C08K5/25; C08L63/04; F16C33/20
Attorney, Agent or Firm:
Okabe
Takao Ochi
Koji Yoshizawa
Masami Saito
Takao Ochi
Koji Yoshizawa
Masami Saito