Title:
SEMICONDUCTOR WAFER ASSEMBLY CUTTING METHOD AND WIRE SAW CUTTING MACHINE FOR SEMICONDUCTOR WAFERS
Document Type and Number:
Japanese Patent JP3042604
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To cut a semiconductor wafer assembly securely and in short time.
SOLUTION: A semiconductor wafer assembly 6 is supported on the inside of a square flat-shaped base 14 comprising metal materials softer than each semiconductor wafer which forms a semiconductor wafer assembly 6 and having multiple sides 14a and 14b, and a wire 10 is reciprocated in the direction crossed at right angle to a pair of sides 14a and 14b opposed to the base 14 so as to cut the semiconductor wafer assembly 6. Also, because the base 14 is formed with a metal material softer than the semiconductor wafers, when the wire 10 reaches the boundary of the semiconductor wafer assembly 6 and the base 14, the base 14 can be cut continuously without producing any side slip, and solder extrusion (stepped) event can be avoided. Any glass debris will not occur by the cutting of the base from the base 14 of the soft metal material as it occurs in the glass base, and debris removal work can be eliminated thus increasing productivity. In addition, both surfaces of the base 14 can be used, and a stress on the wire 10 can also be reduced.
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Inventors:
Koichi Atou
Application Number:
JP2128597A
Publication Date:
May 15, 2000
Filing Date:
February 04, 1997
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
B24B27/06; B28D5/00; B28D5/04; H01L21/301; H01L21/304; (IPC1-7): B24B27/06; B28D5/04; H01L21/301; H01L21/304
Domestic Patent References:
| JP8309737A | ||||
| JP55112755A |
Attorney, Agent or Firm:
Yoshito Nagata (1 person outside)