Title:
分離装置及び分離方法
Document Type and Number:
Japanese Patent JP7340970
Kind Code:
B2
Abstract:
To provide a separation device and a separation method, capable of appropriately separate an object to be processed into first and second separated bodies.SOLUTION: A separation device is configured to separate an object to be processed into first and second separated bodies, the object to be processed including a modified layer that is formed by irradiation with a laser beam. The separation device includes: a first holding part holding the first separated body; a second holding part holding the second separated body; and a movement part relatively moving the first holding part and the second holding part. The second holding part holds inside the outer edge of the second separated body.SELECTED DRAWING: Figure 17
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Inventors:
Yohei Yamawaki
Seiji Nakano
Yoshihiro Kawaguchi
Seiji Nakano
Yoshihiro Kawaguchi
Application Number:
JP2019128166A
Publication Date:
September 08, 2023
Filing Date:
July 10, 2019
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B23K26/53; H01L21/304; H01L21/02; H01L21/677; H01L21/683
Domestic Patent References:
| JP2019106458A | ||||
| JP2014225514A | ||||
| JP2017220631A |
Attorney, Agent or Firm:
Tetsuo Kanemoto
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
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