Title:
電子デバイス製造用溶剤組成物
Document Type and Number:
Japanese Patent JP6652509
Kind Code:
B2
Abstract:
The purpose of the present invention is to provide a solvent composition, for use in ink for forming wiring and electrodes in an electronic device by a printing method, the solvent composition making it possible: to improve ink printing precision; to perform calcining at low temperatures; and to keep the quantity of ash produced after calcining to an extremely low level. This solvent composition for manufacturing an electronic device is used in ink for manufacturing an electronic device by a printing method, and comprises a solvent and a compound represented by formula (1). In the formula, R represents an aliphatic hydrocarbon group with a carbon number of at least 1. The four R's in the formula are all the same group, or are two different groups.
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Inventors:
Yoji Suzuki
Yuichi Sakanishi
Yasuyuki Akai
Yuichi Sakanishi
Yasuyuki Akai
Application Number:
JP2016573286A
Publication Date:
February 26, 2020
Filing Date:
January 26, 2016
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C09D11/03; H01B1/20; H01B3/20; H01G4/30; H05K1/09; H05K3/12
Domestic Patent References:
| JP2009155592A | ||||
| JP8162358A | ||||
| JP2005197079A | ||||
| JP2013149457A |
Attorney, Agent or Firm:
Goto Patent Office