Title:
SURFACE TREATED ALUMINUM NITRIDE POWDER
Document Type and Number:
Japanese Patent JP2022142190
Kind Code:
A
Abstract:
To provide surface treated aluminum nitride powder of low α-ray dose in a state of a resin composition filled in a resin, which is particularly suitable as a filler of the resin composition used as a heat radiating material for a semiconductor.SOLUTION: The surface treated aluminum nitride powder is characterized in that its α-ray dose is 0.005 count/cm2-h or less and hydrophobicity is 1 or more. It is preferable that D50 thereof is from 0.1 to 1.5 μm and the content of coarse particles of 5 μm or more is less than 0.5 mass%. The surface treated aluminum nitride powder is useful as a resin filler. A resin composition including a resin and the resin filler is suitably used as a heat radiation material for a semiconductor, in particular.SELECTED DRAWING: None
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Inventors:
INAGI YOSHITAKA
FUKUNAGA YUTAKA
INAGAWA HISAMORI
FUKUNAGA YUTAKA
INAGAWA HISAMORI
Application Number:
JP2021042266A
Publication Date:
September 30, 2022
Filing Date:
March 16, 2021
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
C01B21/072; C08K3/28; C08K9/00; C08L101/00
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