Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3004329
Kind Code:
B2
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Inventors:
Takao Inose
Yukio Yoshida
Ryusuke Ohta
Yukio Yoshida
Ryusuke Ohta
Application Number:
JP22402790A
Publication Date:
January 31, 2000
Filing Date:
August 23, 1990
Export Citation:
Assignee:
富士通株式会社
株式会社富士通東北エレクトロニクス
株式会社富士通東北エレクトロニクス
International Classes:
H01L21/302; H01L21/3065; H01L21/3205; H01L21/3213; H01L21/768; H01L23/522; (IPC1-7): H01L21/3065
Domestic Patent References:
| JP2210825A | ||||
| JP58175831A | ||||
| JP56158427A | ||||
| JP62272538A |
Attorney, Agent or Firm:
Teiichi Igeta