Title:
METHOD OF FORMING CONDUCTIVE LAYER
Document Type and Number:
Japanese Patent JPS5868960
Kind Code:
A
Abstract:
Method for preparing electrically conductive layers on or in insulating layers, characterized by the feature that the conductivity of at least part of the insulating layer is increased by ion implantation.
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Inventors:
YOAHIMU DAATE
WARUTAA HORUTOSHIYUMITSUTO
WARUTAA HORUTOSHIYUMITSUTO
Application Number:
JP17078482A
Publication Date:
April 25, 1983
Filing Date:
September 29, 1982
Export Citation:
Assignee:
SIEMENS AG
International Classes:
H01L27/04; H01L21/02; H01L21/265; H01L21/31; H01L21/3115; H01L21/3205; H01L21/768; H01L21/822; H01L29/06; H01L29/40; (IPC1-7): H01L21/265; H01L21/31; H01L21/324; H01L21/88; H01L27/04
Domestic Patent References:
| JPS4716990A | ||||
| JPS49110279A | 1974-10-21 | |||
| JPS5642366A | 1981-04-20 | |||
| JPS4922871A | 1974-02-28 |
Attorney, Agent or Firm:
Tomimura Kiyoshi
Previous Patent: ヘテロアリール−シクロヘキシル−テトラアザベンゾ［ｅ］アズレン
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