CONNECTION STRUCTURE AND METHOD OF PRODUCING SAME

Title:

CONNECTION STRUCTURE AND METHOD OF PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2023/189000

Kind Code:

A1

Abstract:

This connection structure is suitable for high-density mounting and is obtained by connecting a first electronic component and a second electronic component via conductive particles and an insulating adhesive agent disposed between an electrode of the first electronic component and an electrode of the second electronic component. The connection structure uses, as said conductive particles, conductive particles having an average particle diameter of less than 3 μm and a compressive hardness (20% K value) at 20% deformation of 1500-8000 N/mm2.

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Inventors:

NODA DAIKI (JP)
AIZAKI RYOTA (JP)

Application Number:

PCT/JP2023/006002

Publication Date:

October 05, 2023

Filing Date:

February 20, 2023

Export Citation:

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Assignee:

DEXERIALS CORP (JP)

International Classes:

C09J9/02; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01R11/01; H01R43/00

Domestic Patent References:

WO2020175691A1

2020-09-03

Foreign References:

JP2017069191A	2017-04-06
JP2018145418A	2018-09-20
JP2019216098A	2019-12-19

Attorney, Agent or Firm:

TAJIME & TAJIME (JP)

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