Title:
CURABLE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT, AND CURED MATERIAL OF SAME
Document Type and Number:
WIPO Patent Application WO/2013/047620
Kind Code:
A1
Abstract:
Provided is a curable resin composition having excellent heat cycle resistance, for sealing an optical semiconductor element. The present invention is characterized in that the glass transition temperature (Tg) of the cured material as measured by the DMA method ranges from −10 to 10°C, and the storage modulus at 0°C as measured by the DMA method ranges form 0 to 150 MPa; the present invention contains an epoxy resin (A) and an epoxy resin curing agent, and the epoxy resin (A) is preferably a silicone backbone epoxy resin.
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Inventors:
MIYAGAWA NAOFUSA (JP)
SASAKI CHIE (JP)
KAWADA YOSIHIRO (JP)
SASAKI CHIE (JP)
KAWADA YOSIHIRO (JP)
Application Number:
PCT/JP2012/074789
Publication Date:
April 04, 2013
Filing Date:
September 26, 2012
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/30; C08G77/38; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| WO2010071168A1 | 2010-06-24 | |||
| WO2011043400A1 | 2011-04-14 | |||
| WO2011108516A1 | 2011-09-09 | |||
| WO2011108588A1 | 2011-09-09 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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Claims: