Title:
CUTTING METHOD FOR PROCESSING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/199784
Kind Code:
A1
Abstract:
Provided is a cutting method for a processing material by which the cut surface that is finally obtained does not deviate significantly from the planned cut surface. The cutting method for a processing material involves causing the planned cut surface of the processing material to absorb laser light thereby forming a modified region, and then cutting the processing material along the planned cut surface. The cutting method for a processing material is configured so that a normal line of the planned cut surface forms a prescribed angle with a normal line of a prescribed low-index surface of the processing material, and so as to include the following: a break suppression processing step for forming a plurality of linear modified regions in an aligned manner, with the distance between laser-light projection lines being a distance such that a break along the prescribed low-index surface does not extend; and a break promotion processing step for forming additional linear modified regions between each linear modified region formed in the break suppression processing step, with the distance between adjacent laser-light projection lines being a distance such that a break along the prescribed low-index surface extends.
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Inventors:
YAMASHITA KENJI (JP)
NANIWAE KOICHI (JP)
NANIWAE KOICHI (JP)
Application Number:
PCT/JP2017/017459
Publication Date:
November 23, 2017
Filing Date:
May 09, 2017
Export Citation:
Assignee:
EL-SEED CORP (JP)
International Classes:
H01L21/304; B23K26/40; B23K26/53; B28D5/00
Foreign References:
| JP2013049161A | 2013-03-14 | |||
| JP2015074004A | 2015-04-20 | |||
| JP2015123466A | 2015-07-06 |
Attorney, Agent or Firm:
SHIGEIZUMI, Tatsushi (JP)
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