Title:
DEVICE FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/248860
Kind Code:
A1
Abstract:
A device for treating a substrate which comprises: a treatment part in which an aqueous solution containing hydrofluoric acid, nitric acid, and phosphoric acid is fed to the substrate; a collecting part which collects the aqueous solution from the treatment part; a regulation part in which the concentrations of the components in the aqueous solution collected by the collection part are regulated; a feeding part which feeds, to the treatment part, the aqueous solution having undergone the regulation in the regulation part; and a control unit which controls the regulation part. The regulation part has both a concentration meter for determining the concentration of hydrofluoric acid in the aqueous solution and a replenishment part in which the aqueous solution is replenished by supplying hydrofluoric acid, nitric acid, and phosphoric acid thereto. The control unit controls the replenishment so that hydrofluoric acid, nitric acid, and phosphoric acid are supplied to the aqueous solution in a desired proportion on the basis of the hydrofluoric acid concentration.
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Inventors:
UNO TAKASHI (JP)
Application Number:
PCT/JP2023/021837
Publication Date:
December 28, 2023
Filing Date:
June 13, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/306; B24B41/06; B24B55/02; H01L21/304
Foreign References:
| JP2008066706A | 2008-03-21 | |||
| JP2009218617A | 2009-09-24 | |||
| JP2018147908A | 2018-09-20 | |||
| JP2006151779A | 2006-06-15 | |||
| JP2004503081A | 2004-01-29 | |||
| JP2013065614A | 2013-04-11 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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