Title:
EPOXY RESIN COMPOSITION, DECORATIVE MATERIAL FOR JOINTS, AND METHODS OF USE FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/135890
Kind Code:
A1
Abstract:
The present invention provides an epoxy resin composition comprising the following components (A) to (D). (A): An epoxy resin. (B): An epoxy resin curing agent that contains a reaction composition (b) containing the reaction product of a polyamine (b1) which contains an amine compound represented by general formula (1) and an epoxy compound (b2); H2N-CH2-A-CH2-NH2 (1) (in formula (1), A is a phenylene group or a cycloalkylene group). (C) A thixotropy imparting agent. (D) A film-form powder. The reaction composition (b) is obtained by reacting the polyamine (b1) and the epoxy compound (b2) at a molar ratio of 2.2/1 to 4.8/1. The thickness of the film-form powder (D) is 0.5-50 μm. Also provided is a decorative material for joints and methods of use for the epoxy resin composition and the decorative material for joints.
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Inventors:
HANAOKA TAKUMA (JP)
KOUNO KAZUKI (JP)
KOUNO KAZUKI (JP)
Application Number:
PCT/JP2022/039809
Publication Date:
July 20, 2023
Filing Date:
October 26, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L63/00; C08G59/50; C08K7/00; C09K3/10; E04F13/08
Foreign References:
| JPH1129622A | 1999-02-02 | |||
| JPH03177418A | 1991-08-01 | |||
| JPS5742723A | 1982-03-10 | |||
| JP2014037506A | 2014-02-27 | |||
| JP2007224285A | 2007-09-06 | |||
| JP2007186693A | 2007-07-26 | |||
| JP2020172634A | 2020-10-22 | |||
| JP2006052240A | 2006-02-23 | |||
| JP2005225797A | 2005-08-25 | |||
| JP2001163955A | 2001-06-19 | |||
| JPH09176292A | 1997-07-08 | |||
| JPH08127637A | 1996-05-21 | |||
| JPS63284167A | 1988-11-21 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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