Title:
HEAT-CURABLE RESIN COMPOSITION, RESIN SHEET, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/074429
Kind Code:
A1
Abstract:
The present invention provides a heat-curable resin composition capable of giving cured objects which have reduced moduli and improved flexibility and are less apt to have impaired heat resistance. The heat-curable resin composition comprises a maleimide compound (A) having at least two maleimide groups in the molecule, one or more compounds (B) which have, at an end, a substituent containing an ethylenically unsaturated bond and have a poly(phenylene ether) skeleton, and an inorganic filler (C). The compounds (B) include a compound (B1) having a butadiene-derived structural unit.
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Inventors:
YAMADA YUJI
SAITO EIICHIRO
FUJISAWA HIROYUKI
YAMADA TAKAHIRO
SAITO EIICHIRO
FUJISAWA HIROYUKI
YAMADA TAKAHIRO
Application Number:
PCT/JP2022/038564
Publication Date:
May 04, 2023
Filing Date:
October 17, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F290/06; B32B15/08; C08F290/14; C08F299/02; H05K1/03
Foreign References:
| JP2020158704A | 2020-10-01 | |||
| JP2008095061A | 2008-04-24 | |||
| US20180037705A1 | 2018-02-08 | |||
| JP2020506982A | 2020-03-05 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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