Title:
JET COOLING APPARATUS, CHIP ASSEMBLY AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/222870
Kind Code:
A1
Abstract:
Disclosed in the present application are a jet cooling device, a chip assembly and an electronic device. The jet cooling apparatus comprises a top cover, a jet plate and at least one supporting member, wherein the top cover is provided with an accommodating cavity and a liquid intake pipeline, the jet plate is accommodated in the accommodating cavity and movably connected to the top cover, the jet plate comprises a first surface and a second surface, which are opposite each other, and jet holes passing through the first surface and the second surface, and the at least one supporting member is fixedly connected to the second surface of the jet plate for abutting against a chip. A cooling medium is jetted to a surface of the chip by means of the jet plate, so as to perform cooling and heat dissipation on the chip. During mounting of the jet cooling apparatus and the chip, since the jet plate is movably connected to the top cover, the jet plate has a moving degree of freedom relative to the top cover while the top cover is fixedly connected to a substrate, such that tolerance generated by warping of the chip can be adapted, and an abutting surface of the at least one supporting member abuts against the chip, thereby effectively controlling a jet height between the jet plate and the chip and achieving a better cooling effect.
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Inventors:
WANG CHAO (CN)
MAISON NIKOLAY VLADIMIROVICH (CN)
SAKAMOTO HITOSHI (CN)
LIN HUI (CN)
MAISON NIKOLAY VLADIMIROVICH (CN)
SAKAMOTO HITOSHI (CN)
LIN HUI (CN)
Application Number:
PCT/CN2022/087181
Publication Date:
October 27, 2022
Filing Date:
April 15, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/473; H01L23/367; H05K1/18
Foreign References:
| US5349831A | 1994-09-27 | |||
| CN111446221A | 2020-07-24 | |||
| CN101080160A | 2007-11-28 | |||
| JPH0766339A | 1995-03-10 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
Download PDF:
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