Title:
LAMINATED STRUCTURE AND PREPARATION METHOD THEREFOR, PATTERN TRANSFER METHOD, AND REWORKING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/045270
Kind Code:
A1
Abstract:
A laminated structure and a preparation method therefor, a pattern transfer method, and a reworking method. A stripping layer (100) capable of being etched and removed by means of a wetting method is arranged below a bottom anti-reflection structure (200), so that pattern transfer can be realized, and when reworking is needed, a substrate can be separated by removing the stripping layer (100) by means of the wetting method, so that the reworking difficulty is greatly reduced, and the substrate is not damaged, thereby avoiding the formation of defects.
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Inventors:
HE XIAOBIN (CN)
LI TINGTING (CN)
YANG TAO (CN)
LIU JINBIAO (CN)
LI JUNFENG (CN)
LUO JUN (CN)
LI TINGTING (CN)
YANG TAO (CN)
LIU JINBIAO (CN)
LI JUNFENG (CN)
LUO JUN (CN)
Application Number:
PCT/CN2022/124813
Publication Date:
March 07, 2024
Filing Date:
October 12, 2022
Export Citation:
Assignee:
INST OF MICROELECTRONICS CAS (CN)
International Classes:
H01L21/027; G03F7/09; G03F7/11
Foreign References:
| US4692205A | 1987-09-08 | |||
| CN101770940A | 2010-07-07 | |||
| CN210805810U | 2020-06-19 | |||
| CN103345130A | 2013-10-09 | |||
| CN108682621A | 2018-10-19 | |||
| US20050147924A1 | 2005-07-07 |
Attorney, Agent or Firm:
BEIJING CHEN QUAN INTELLECTUAL PROPERTY LAW FIRM (CN)
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