Title:
LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/153010
Kind Code:
A1
Abstract:
A control unit performs, in a state in which a distance between a first light collection point and a second light collection point is set to a first distance, a first process for irradiating a subject with the laser light while relatively moving the first light collection point and the second light collection point along a first line, and performs, in a state in which the distance between the first light collection point and the second light collection point is set to a second distance shorter than the first distance, a second process for irradiating the subject with the laser light while relatively moving the first light collection point and the second light collection point along a second line.
More Like This:
| JP2023110151 | INSPECTION METHOD FOR CHIP |
| WO/2021/193060 | METHOD FOR MANUFACTURING THINNED WAFER AND DEVICE FOR MANUFACTURING THINNED WAFER |
| JP2023085733 | LASER PROCESSING DEVICE |
Inventors:
KOREMATSU KATSUHIRO (JP)
SAKAMOTO TAKESHI (JP)
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2020/045531
Publication Date:
August 05, 2021
Filing Date:
December 07, 2020
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; B23K26/067; H01L21/301
Domestic Patent References:
| WO2015182236A1 | 2015-12-03 |
Foreign References:
| JP2015062943A | 2015-04-09 | |||
| JP2017064747A | 2017-04-06 | |||
| JP2011051011A | 2011-03-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: