Title:
LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/146110
Kind Code:
A1
Abstract:
There is a problem in conventional laser processing methods in that when pulse laser light continuously irradiates an outer peripheral part, a large amount of heat accumulates in a single conformal mask and thus an insulating material is selectively decomposed and eliminated so that glass cloth protrusions may easily be produced. This laser processing method, designed to implement conformal processing in which a plurality of holes are formed, solves the problem stated above and has: a first processing step for radiating laser light 1 on a region defined on the inside or outside of a first mask 30a from among a plurality of conformal masks 30a - 30f provided in conformity with the number of holes; and processing steps, different from the first processing step, for radiating laser light 1 on the inside or outside of masks 30b - 30f, differing from the first mask 30a, from among the conformal masks 30a - 30f. A processing procedure in which the first processing step and the different processing steps are carried out is repeated multiple times and the laser light 1 irradiation position is varied each time said processing procedure is repeated, to complete the processing.
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Inventors:
KUDO YUKITOSHI (JP)
Application Number:
PCT/JP2018/002755
Publication Date:
August 01, 2019
Filing Date:
January 29, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/386; B23K26/00; B23K26/08; H05K3/00
Foreign References:
| JP2011103374A | 2011-05-26 | |||
| JP5162977B2 | 2013-03-13 | |||
| JP2003285177A | 2003-10-07 | |||
| JP2014034045A | 2014-02-24 | |||
| DE102014220526A1 | 2016-04-14 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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