Title:
MULTILAYER FILM FOR INDIVIDUALIZED PIECE FORMATION, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/136059
Kind Code:
A1
Abstract:
The present invention discloses a multilayer film for individualized piece formation. This multilayer film for individualized piece formation sequentially comprises, in the following order: a first support film; a first adhesive layer that is a non-ultraviolet curable adhesive layer; a film for individualized piece formation, the film being separated into a plurality of individualized pieces by dicing; a second adhesive layer; and a second support film. The film for individualized piece formation has a thermosetting resin layer and a stiff material layer that has a higher stiffness than the thermosetting resin layer. The stiff material layer of the film for individualized piece formation is superposed on the first adhesive layer.
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Inventors:
HASHIMOTO HIROKI (JP)
TANIGUCHI KOHEI (JP)
KURODA TAKAHIRO (JP)
OZAKI YOSHINOBU (JP)
OKAWARA KEISUKE (JP)
NAKAMURA KANAMI (JP)
TANIGUCHI KOHEI (JP)
KURODA TAKAHIRO (JP)
OZAKI YOSHINOBU (JP)
OKAWARA KEISUKE (JP)
NAKAMURA KANAMI (JP)
Application Number:
PCT/JP2022/046955
Publication Date:
July 20, 2023
Filing Date:
December 20, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/52; C09J7/38; H01L21/301
Domestic Patent References:
| WO2020218526A1 | 2020-10-29 | |||
| WO2020217397A1 | 2020-10-29 | |||
| WO2014157426A1 | 2014-10-02 | |||
| WO2020031543A1 | 2020-02-13 |
Foreign References:
| JP2012158653A | 2012-08-23 | |||
| JP2013243195A | 2013-12-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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