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Title:
NON-CONTACT IC TAG LABEL, AIRLINE LUGGAGE TAG LABEL, AND METHOD FOR PRODUCING NON-CONTACT IC TAG LABEL
Document Type and Number:
WIPO Patent Application WO/2008/056564
Kind Code:
A1
Abstract:
Disclosed is a non-contact IC tag label (1) comprising a strip-shaped label base (9) having at least a release-treated releasing surface (8) formed on one end and a non-releasing surface (8n), a conductive layer (6) formed on the non-releasing surface (8n) of the strip-shaped label base (9) and having a certain antenna pattern, and an IC chip (3) mounted on one side of the conductive layer (6). The conductive layer (6) and the IC chip (3) are covered with a surface protection sheet (4) through an adhesive layer (5). A surface of the conductive layer (6) of an antenna pattern which is opposite to the surface protection sheet (4) is provided with a thermally adhesive resin layer (7) which is bonded to the non-releasing surface (8n) of the strip-shaped label base (9). The adhesive layer (5) is bonded to the non-releasing surface (8n) and the releasing surface (8) of the strip-shaped label base (9).

Inventors:
OGATA TETSUJI (JP)
SAKATA HIDETO (JP)
Application Number:
PCT/JP2007/071087
Publication Date:
May 15, 2008
Filing Date:
October 30, 2007
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
OGATA TETSUJI (JP)
SAKATA HIDETO (JP)
International Classes:
G06K19/077; G06K19/00; G06K19/07; G09F3/00; G09F3/10; G09F3/16
Foreign References:
JP2003162221A2003-06-06
JP2004094502A2004-03-25
JP2005346696A2005-12-15
Attorney, Agent or Firm:
YOSHITAKE, Kenji et al. (Room 323 Fuji Bldg., 2-3, Marunouchi 3-chom, Chiyoda-ku Tokyo 05, JP)
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