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Title:
POLYAMIDE ACID, POLYAMIDE ACID SOLUTION, POLYIMIDE, POLYIMIDE FILM, LAMINATE, FLEXIBLE DEVICE, AND METHOD OF MANUFACTURING POLYIMIDE FILM
Document Type and Number:
WIPO Patent Application WO/2018/042999
Kind Code:
A1
Abstract:
The polyamide acid according to the present invention contains 2,2-bistrifluoromethyl benzidine and trans-1,4-cyclohexane diamine as diamine components, and pyromellitic anhydride and 3,3,4,4-biphenyltetracarboxylic dianhydride as tetracarboxylic dianhydride components. The proportion of trans-1,4-cyclohexane diamine to the total diamine content is preferably 0.5–40 mol%. The polyimide is obtained through dehydration ring closure of the polyamide acid.

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Inventors:
UNO MARI (JP)
Application Number:
PCT/JP2017/027744
Publication Date:
March 08, 2018
Filing Date:
July 31, 2017
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; B29C41/12; B32B27/34; C08J5/18; C08L79/08; B29K79/00; B29L7/00
Domestic Patent References:
WO2009107429A12009-09-03
Foreign References:
JP2002327056A2002-11-15
JP2007231224A2007-09-13
JP2015101710A2015-06-04
JP2015004062A2015-01-08
JP2007046054A2007-02-22
KR20140118386A2014-10-08
US20160128187A12016-05-05
Attorney, Agent or Firm:
SHINTAKU, Masato et al. (JP)
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