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Patent Searching and Data


Title:
POLYPROPYLENE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1991/018049
Kind Code:
A1
Abstract:
A polypropylene resin composition which can provide a material having high strength and rigidity, reduced warpage, and such an excellent mechanical durability that it can be used even under the condition of a prolonged or repeated application of load. The composition comprises 40 to 75 wt % of modified polypropylene (a) prepared by melting a mixture of crystalline polypropylene with at least 0.01 to 2 wt % of an unsaturated acid, 0.1 to 3 wt % of an unsaturated silane and an organic peroxide, 10 to 35 wt % of glass fiber (b) and 15 to 45 wt % of powdery mica (c), wherein the total content of components (b) and (c) is within the range of 25 to 60 wt %.

Inventors:
TAKEI HIROSHI (JP)
YONAIYAMA RIKIO (JP)
KASAI MICHIO (JP)
ATSUMI NOBUKAZU (JP)
Application Number:
PCT/JP1991/000668
Publication Date:
November 28, 1991
Filing Date:
May 20, 1991
Export Citation:
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Assignee:
CHISSO CORP (JP)
International Classes:
C08F4/32; C08K3/34; C08K7/00; C08K7/14; C08K13/04; C08L23/26; C08L51/06; (IPC1-7): C08K3/34; C08K7/14; C08L23/26; C08L51/06
Foreign References:
JPS6411218B1
JPS58217532A1983-12-17
JPS5550065B21980-12-16
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