Title:
SEMICONDUCTOR CLEANING AGENT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/024759
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a semiconductor cleaning agent composition that exhibits high removal performance with respect to ceria particles which are metal residue remaining on a substrate. The present invention is a semiconductor cleaning agent composition comprising a pH adjuster and a polymer that has a structural unit derived from a carboxylic acid-based monomer, wherein the weight-average molecular weight of the polymer is not less than 3,100, the pH adjuster is one or more compounds selected from the group consisting of metal hydroxides and amine compounds, and pH is not less than 7.
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Inventors:
HARIGAE TAKAKO (JP)
Application Number:
PCT/JP2023/027090
Publication Date:
February 01, 2024
Filing Date:
July 25, 2023
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
International Classes:
H01L21/304; C11D1/72; C11D1/722; C11D3/30; C11D7/32
Domestic Patent References:
| WO2018168207A1 | 2018-09-20 |
Foreign References:
| JP2003289060A | 2003-10-10 | |||
| JP2006041494A | 2006-02-09 | |||
| JP2012044118A | 2012-03-01 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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