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Title:
SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/233869
Kind Code:
A1
Abstract:
This semiconductor device comprises: a semiconductor package; a cooler for cooling the semiconductor package; a sealing member that is provided interposed between the semiconductor package and the cooler, the sealing member having an opening that penetrates between the semiconductor package and the cooler; and a heat conduction member that is constituted by a metal that has fluidity, said metal being filled into the opening.

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Inventors:
NAKAJIMA YUTA (JP)
OGURA KEISUKE (JP)
Application Number:
PCT/JP2023/016200
Publication Date:
December 07, 2023
Filing Date:
April 25, 2023
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L23/36; H01L23/40; H01L23/473; H01L25/07; H01L25/18; H05K7/20
Domestic Patent References:
WO2020162417A12020-08-13
Foreign References:
JP3116877U2005-12-22
JP2003152149A2003-05-23
JP2013251473A2013-12-12
JP2018110187A2018-07-12
JPH02224265A1990-09-06
JPH05206180A1993-08-13
JP2006332479A2006-12-07
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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