Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2023/249000
Kind Code:
A1
Abstract:
A semiconductor module according to one aspect of the present disclosure comprises a first substrate, a second substrate, and a cooler. The first substrate is provided with a first semiconductor element on one main surface thereof, and is provided with a cooling plate on the other main surface thereof. The second substrate is disposed oppositely from the first substrate, is provided with a second semiconductor element on one main surface thereof that faces the one main surface of the first substrate, and is provided with a cooling plate on the other main surface thereof. The cooler is disposed between the first substrate and the second substrate and, at a heat transfer part, at least surfaces of the cooler which face the one main surface of the first substrate and the one main surface of the second substrate are covered with an insulation layer.
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Inventors:
MAEDA RYO (JP)
Application Number:
PCT/JP2023/022703
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
Assignee:
NIDEC CORP (JP)
International Classes:
H01L23/473; H01L23/427; H01L25/07; H01L25/18; H02M7/48; H05K7/20
Domestic Patent References:
| WO2010147199A1 | 2010-12-23 | |||
| WO2011064841A1 | 2011-06-03 |
Foreign References:
| JPH09260559A | 1997-10-03 | |||
| JP2001244407A | 2001-09-07 | |||
| JP2010062491A | 2010-03-18 | |||
| JP2018037545A | 2018-03-08 | |||
| JP2013123040A | 2013-06-20 |
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