Title:
SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/053420
Kind Code:
A1
Abstract:
This semiconductor package comprises: a plurality of semiconductor elements (1); a plurality of plate-shaped bridging members (5) that are connected to different semiconductor elements; a lead frame (2) having a plurality of mounting parts (21) on which different semiconductor elements are mounted; and a sealing resin (6) that covers a portion of the lead frame as well as the plurality of semiconductor elements and bridging members. Each of the plurality of bridging members is disposed spaced apart by a distance from the other bridging members, and each bridging member electrically connects a semiconductor element to an area (21, 22) of the lead frame which is different from the mounting part on which the semiconductor element to which the bridging member is connected is mounted. Each of the plurality of mounting parts is disposed spaced apart from the other mounting parts. An end gap (G2) is wider than a center gap (G1), when: a direction along a bridging member in which the semiconductor element and the above-mentioned different area are connected is a connection direction (D1); a gap at the center in the connection direction of the gap between the bridging member and another adjacent bridging member is the center gap; and a gap at the end in the connection direction is the end gap.
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Inventors:
NAKANO TAKAHIRO (JP)
NAGASE NOBORU (JP)
NAGASE NOBORU (JP)
Application Number:
PCT/JP2023/030589
Publication Date:
March 14, 2024
Filing Date:
August 24, 2023
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L21/60; H01L23/29; H01L23/48; H01L25/18
Domestic Patent References:
| WO2021005916A1 | 2021-01-14 |
Foreign References:
| JP2022099720A | 2022-07-05 | |||
| JP2002100716A | 2002-04-05 | |||
| DE102019206811A1 | 2020-11-12 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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